RDL For Fan Out

The benefits of embedded package integration in Fan Out Wafer-Level Package (FOWLP) technology include miniaturization, improvement of electrical and thermal performance, cost reduction and simplification of logistics. FOWLP technology offers flexibility with higher interconnect density and using different size die making it of great interest to mobile electronics manufacturers.

Tango provides the Axcela platform for round substrates, from 150mm to 330mm and the Topaz platform for rectangular panels up to 600mm x 600mm.

Click here for more information on the Axcela or Topaz platforms.