Compact system with Individual modules for all necessary functions of DeGas, Preclean, sputter deposition and a high vacuum robotic transfer chamber.
Single wafer sputtering system.
Smallest Footprint in industry
Fully Automated Cassette to Cassette
Designed to meet High performance R&D and Low volume Production
Plug and Play System Design with minimal setup time.
D-source magnetron technology with proven process flows gives the flexibility to deposit a variety of films:
- Single layer, Multi-layer metals, oxides and semiconductors
- Low CoO
- Co-sputtered alloys of metals, oxides
- RF or Pulsed DC or DC sputtering
Software with Remote diagnostics, SECS/GEM compliance
Reliable system with high uptime, >92%
Special Process kits for:
- Lift Off process
- Ionized PVD for TSV
Wafer Sizes (mm): up to 300mm.
Footprint: 1657mm x 755mm x 1822mm
Substrates: Silicon, Gas, Glass, Organic, metal