Molded Subtrates

The benefits of embedded package integration in Fan Out Wafer-Level Package (FOWLP) technology include miniaturization, improvement of electrical and thermal performance, cost reduction and simplification of logistics. FOWLP technology offers flexibility with higher interconnect density and using different size die making it of great interest to mobile electronics manufacturers.

Tango’s provides the Axcela platform for round substrates, from 300mm to 450mm on and the Topaz platform for rectangular panels from 300×300 to 530x530mm.

Click here for more information on Topaz.