Axcela™, the best in class sputtering system has demonstrated process superiority and stability with uniformities of <0.3% 1σ over last 10 years. The easily configurable design, allows the customer to select the most optimal process for a given application. Designed for the lowest cost of ownership (CoO) and easy serviceability, each sputter chamber has the standard capability of depositing up to 3 different materials with an optional 4th material.

The Small-Batch-Cluster architecture makes this PVD system an excellent choice for most metallization applications, including BSM (Back Side Metallization), MEMS, TSV (Through Silicon Via), UBM (Under Bump Metallization) and RDL (Re-distributed Layer).

Process control with Small-Batch processing

Deposition thickness can be closely controlled to a few angstroms, giving absolute power to the process and manufacturing engineers to meet demanding design requirements.

Unlike single-wafer cluster tools, the Axcela™ runs 5x 300mm wafers per run to maximize throughput.

The patented D-Source magnetron provides high target utilization with full face erosion and best class collection efficiency in the industry. The chamber and target architecture enable the atoms coming from target to be usable on the substrate, instead of wasting them on the shields. D-source magnetron with delta shaped targets help Tango meet the most demanding particle requirements with ease.

The Axcela™ System Advantages

  • High Throughput
  • Low CoO
  • Small Footprint
  • Wafer Size Flexibility
  • Process Flexibility
  • Application Flexibility
  • High Reliability
  • No remote subsystems


Axcela System Configurations

The Axcela™ system can be configured with many combinations of pre-clean and PVD chambers, depending on wafer size, process and throughput requirements. A 200mm and a 300mm chamber are shown below.

Axcela 5 with EFEM

Axcela 7 – EMI

Axcela 7 with EFEM