Delivering Tomorrow's Technology Today. Innovation Matters

Axcela

The Axcela™ system offers an easily scalable design, allowing the customer to select the most flexible, cost-effective design for a given application.

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Topaz

The Topaz platform is a field proven tool for panel level packaging.”

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Onyx

Onyx is Tango’s lowest cost innovation for low volume production and R&D applications.

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Leading Markets

EMI Shielding
Tango Systems is the leading supplier for next generation shielding technologies. Both for single layer as well as multi-layer shielding.
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Backside Metallization
Backside metallization is required for many high performance applications like power devices, microprocessors, laser diodes where backside contacts are needed for subsequent die attach.
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Fan Out for PLP
The demand for lower cost and higher performance electronics is the motivation for the industry transition from wafer level processing to panel level processing. Normalized capital costs are less than half of wafer level formats.
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Fan Out for WLP
The benefits of embedded package integration in Fan Out Wafer-Level Package (FOWLP) technology include miniaturization, improvement of electrical and thermal performance, cost reduction and simplification of logistics.
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TSV/Interposers
Through Silicon Via (TSV) has emerged as the process of choice of interconnecting stacked and thinned 2-D circuits.
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UBM/RDL Bumping
UBM stack must provide a strong, stable low resistance electrical connection to the IC’s pads and the surrounding passivation layer.
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Who We Are

Tango Systems, Inc. is based in the heart of Silicon Valley and is a leading innovator in high performance, cost-effective physical vapor deposition (PVD) systems. Tango is at the forefront of 5G EMI, PVD technology, and Backside Metallization (BSM). Tango has exemplified leadership in PVD technology providing a versatile platform for all formats: Wafer, Reconstituted Rings and Panel. Tango tools are field proven with more than 10 years of production globally.